Atotech (China) Chemicals Ltd.SH安美特上海青浦分公司
PRESENTS
ELECTROPLATING
TRAINING
电镀培训
OUTLINE内容提要
INTRODUCTION
介绍
ELECTROCHEMISTRY
电化学
CLEANING & PREPLATE
清洗及预镀
NICKEL 镍
Copper 铜
DECORATIVE CHROMIUM
装饰铬
TESTING
测试
FILTRATION
过滤
TROUBLE SHOOTING
故障处理
WHATISELECTROPLATING什么是电镀？
THE DEPOSITION OF A METALLIC COATING UPON A NEGATIVELY CHARGED CATHODE BY THE PASSING OF AN ELECTRIC CURRENT
在电流通过时，有金属层沉积在带负电荷的阴极表面.
WHATISTHEPURPOSE电镀的目的是什么？
TO OBTAIN A METALLIC COATING HAVING CERTAIN PROPERTIES SUCH AS HARDNESS, BRIGHTNESS, CORROSION RESISTANCE AND TO REPRODUCE IDENTICAL FORMS IN ELECTROFORMING.
是为了得到具有某种特性的金属层，如：硬度、光亮度、耐腐性及在电铸方面复制同样的形状.
REQUIREMENTS要求
SOURCE OF DIRECT CURRENT
直流电源
A PLATING TANK
电镀槽
A SOLUTION CONTAINING THE DISSOLVED SALTS OF THE METAL TO BE PLATED
含有待镀的可溶性金属盐的溶液
ANODE ( POSITIVEELECTRODE )
阳极（正电极）
A PREPAREDOBJECT - CATHODE( NEGATIVE ELECTRODE )
准备好的待镀工件--阴极（负电极）